The flip-chip approach for millimeter-wave packaging

IEEE Microwave Magazine

Volumn 6, Issue 3, 2005, Pages 36-45

  Heinrich, Wolfgang ^a  

^a LEIBNIZ INSTITUT FÜR HÖCHSTFREQUENZTECHNIK   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP-CHIP TECHNIQUES; MILLIMETER WAVE PACKAGING; RF FLIP-CHIP INTEGRATION; THERMOCOMPRESSION;

COMPACTION; COMPUTER SIMULATION; FLIP CHIP DEVICES; NATURAL FREQUENCIES; OPTICAL INTERCONNECTS; SOLDERING;

ELECTRONICS PACKAGING;

EID: 27344460253     PISSN: 15273342     EISSN: None     Source Type: Trade Journal    
DOI: 10.1109/MMW.2005.1511912     Document Type: Article

References (10)

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