Millimeter-wave characteristics of flip-chip interconnects for multichip modules

IEEE Transactions on Microwave Theory and Techniques

Volumn 46, Issue 12 PART 2, 1998, Pages 2264-2268

  Heinrich, Wolfgang ^a   Jentzsch, Andrea ^b   Baumann, Guido ^a  

^a LEIBNIZ INSTITUT FÜR HÖCHSTFREQUENZTECHNIK   (Germany)

^b SEL Verteidigungssysteme GmbH   (Germany)

Author keywords

Finite difference methods; Flip chip devices; MMIC multichip modules; Packaging

Indexed keywords

COMPUTER SIMULATION; ELECTROMAGNETISM; ELECTRONICS PACKAGING; FINITE DIFFERENCE METHOD; FLIP CHIP DEVICES; FREQUENCY DOMAIN ANALYSIS; MATHEMATICAL MODELS; MILLIMETER WAVE DEVICES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; MULTICHIP MODULES;

MILLIMETER WAVE MULTICHIP INTERCONNECTS;

INTERCONNECTION NETWORKS;

EID: 0032304021     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.739208     Document Type: Article

References (8)

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