An accurate equivalent circuit model of flip chip and via interconnects

IEEE Transactions on Microwave Theory and Techniques

Volumn 44, Issue 12 PART 2, 1996, Pages 2543-2554

  Ghouz, Hussein H M ^a   El Sharawy, E L Badawy ^a  

^a Arizona State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; EQUIVALENT CIRCUITS; FINITE DIFFERENCE METHOD; FREQUENCY DOMAIN ANALYSIS; FREQUENCY RESPONSE; IMPEDANCE MATCHING (ELECTRIC); INTEGRATED CIRCUIT LAYOUT; MATHEMATICAL MODELS; MICROSTRIP LINES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; PRINTED CIRCUIT DESIGN; TIME DOMAIN ANALYSIS;

TRANSITION DISCONTINUITIES; VIA HOLES;

FLIP CHIP DEVICES;

EID: 0030422066     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.554598     Document Type: Article

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