A method for mechanical characterization of capacitive devices at wafer level via detecting the pull-in voltages of two test bridges with different lengths

Journal of Micromechanics and Microengineering

Volumn 17, Issue 6, 2007, Pages 1099-1106

  Hu, Yuh Chung ^a   Shih, Wen Pin ^b   Lee, Guan De ^a  

^a HUAFAN UNIVERSITY   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; CRYSTALLINE MATERIALS; ELASTIC MODULI; ELECTRIC POTENTIAL; RESIDUAL STRESSES; SILICON WAFERS;

CAPACITIVE DEVICES; MICRO TEST BEAMS; PULL-IN VOLTAGES; WAFER-LEVEL TESTING;

MEMS;

EID: 34249667277     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/17/6/001     Document Type: Article

References (32)

1. Petersen K E and Guarnieri C R 1979 Young's modulus measurements of thin films using micromechanics J. Appl. Phys. 50 6761-6
2. Zhang L M, Uttamchandani D and Culshaw B 1991 Measurement of mechanical properties of silicon microresonators Sensors Actuators A 29 79-84
3. Kiesewetter L, Zhang J-M, Houdeau D and Steckenborn A 1992 Determining of Young's moduli of micromechanical thin films using the resonance method Sensors Actuators A 35 153-9
4. Vlassak J J and Nix W D 1992 A new bulge test technique for the determination of Young's modulus and Poisson's ratio of thin films J. Mater. Res. 7 3242-9
5. Najafi K and Suzuki K 1989 A novel technique and structure for the measurement of intrinsic stress and Young's modulus of thin films Proc. IEEE MEMS (Salt Lake City, UT)
6. Zou Q, Li Z and Liu L 1995 New methods for measuring mechanical properties of thin films in micromachining: beam pull-in voltage (Vpi) method and long beam deflection (LBD) method Sensors Actuators A 48 137-43
7. Osterberg P M and Senturia S D 1997 M-TEST: a test chip for MEMS material property measurement using electrostatically actuated test structures J. Microelectromech. Syst. 6 107-18
8. Gupta R K 1997 Electrostatic pull-in test structure design for in-situ mechanical property measurements of microelectromechanical system (MEMS) PhD Thesis MIT
9. Sharpe W N Jr, Yuan B and Edwards R L 1997 A new technique for measuring the mechanical properties of thin films J. Microelectromech. Syst. 6 193-9
10. Johansson S, Schweitz J-A, Tenerz L and Tiren J 1988 Fracture testing of silicon microelements in situ in a scanning electron microscope J. Appl. Phys. 66 4799-803
11. Serre C, Gorostiza P, Perez-Rodriguez A, Sanz F and Morante J R 1998 Measurement of micromechanical properties of polysilicon microstructures with an atomic force microscope Sensors Actuators A 57 215-9
12. Serre C, Perez-Rodriguez A, Morante J R, Gorostiza P and Esteve J 1999 Determination of micromechanical properties of thin films by beambending measurements with an atomic force microscope Sensors Actuators A 74 134-8
13. Chudoba T, Schwarzera N, Richtera F and Beck 2000 Determination of mechanical film properties of a bilayer system due to elastic indentation measurements with a spherical Thin Solid Films 377 366-72
14. Guckel H, Burns D W, Tilmans H A C, Visser C C G, DeRoo D, Christenson T R, Klomberg P J, Sniegowski J J and Jones D H 1988 Processing conditions for polysilicon films with tensile strain for large aspect ratio microstructures Tech. Dig. IEEE Solid-State Sensor and Actuator Workshop (6-9 June) pp 51-6
15. Guckel H, Burns D W, Tilmans H A C, DeRoo D and Rutigliano C 1988 Mechanical properties of fine grained polysilicon-the repeatability issue Tech. Dig. IEEE Solid-State Sensor and Actuator Workshop (6-9 June) pp 96-9
16. Guckel H, Burns D W, Visser C C G, Tilmans H A C and DeRoo D 1988 Fine grained polysilicon films with built-in tensile strain IEEE Trans. Electron. Devices 35 800-1
17. Guckel H, Burns D W, Rutigliano C, Lovell E and Choi B 1992 Diagnostic microstructures for the measurement of intrinsic strain in thin films J. Micromech. Microeng. 2 86-95
18. Wylde J and Hubbard T J 1999 Elastic properties and vibration of micro-machined structures subject to residual stress Proc. 1999 IEEE Canadian Conf. on Electrical and Computer Engineering (Shaw Conference Center, Edmonton, Alberta, Canada, 9-12 May) p 1674
19. Fang W and Wickert J A 1995 Comment on measuring thin-film stresses using bi-layer micromachined beams J. Micromech. Microeng. 5 276-81
20. Fang W and Wickert J A 1996 Determining mean and gradient residual stress in thin films using micromachined cantilevers J. Micromech. Microeng. 6 301-9
21. Schweitz J A and Ericson F 1999 Evaluation of mechanical materials properties by means of surface micromachined structures Sensors Actuators A 74 126-33
22. Fang W and Wickert J A 1994 Post-buckling of micromachined beams J. Micromech. Microeng. 4 182-7
23. Riester L, Blau P J, Lara-Curzio E and Breder K 2000 Nanoindentation with a Knoop indenter Thin Solid Films 377 635-9
24. Li X, Ono T, Wang Y and Esashi M 2003 Ultrathin single-crystalline- silicon cantilever resonators: fabrication technology and significant specimen size effect on Young's modulus Appl. Phys. Lett. 83 3081-3
25. Yang J, Ono T and Esashi M 2000 Mechanical behavior of ultrathin microcantilever Sensors Actuators A 82 102-7
26. Meijs N V D and Fokkema J T 1984 VLSI circuit reconstruction from mask topology Integr. VLSI J. 2 85-119
27. Leus V and Elata D 2004 Fringing field effect in electrostatic actuators Technical Report ETR-2004-2 Israel Institute of Technology
28. Soedel W 1993 Vibrations of Shells and Plates 2nd edn (New York: Dekker) p 71
29. Lishchynska M, Cordero N and Slattery O 2005 Development of behavior models for mechanically loaded microcantilevers and beams Analog Integr. Circuits Signal Process. 44 109-18
30. Chinmulgund M, Inturi R B and Barnard J A 1995 Effect of Ar gas pressure on growth, structure, and mechanical properties of sputtered Ti, Al, TiAl, and Ti3Al films Thin Solid Films 270 260-3
31. Hu Y C 2006 Closed form solutions for the pull-in voltage of the micro curled beams subjected to electrostatic loads J. Micromech. Microeng. 16 648-55
32. Hu Y C and Wei C S 2007 An analytical model considering the fringing fields for calculating the pull-in voltage of micro curled cantilever beams J. Micromech. Microeng. 17 61-7