Quantitative model-based interpretation of experimentally measured nanoscale stress sources at wafer bonded interfaces

ECS Transactions

Volumn 3, Issue 6, 2006, Pages 227-238

  Horn, G ^a   Johnson, H T ^a   Mackin, T J ^b   Lesniak, J R ^c  

^a University of Illinois at Urbana Champaign   (United States)

^b CALIFORNIA POLYTECHNIC STATE UNIVERSITY   (United States)

^c Stress Photonics   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

NANOTOPOGRAPHY; SURFACE PATTERNING;

COMPUTER SIMULATION; MATHEMATICAL MODELS; NANOTECHNOLOGY; TOPOGRAPHY; WAFER BONDING;

SILICON WAFERS;

EID: 34249038972     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2357073     Document Type: Conference Paper

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