Locating and tracking the evolution of debonds at the interface of bonded semiconductor devices using infrared photoelasticity

Sensors and Materials

Volumn 17, Issue 6, 2005, Pages 317-333

  Horn, Gavin ^a   Mackin, Thomas J ^a   Lesniak, Jon ^a,b  

^a University of Illinois at Urbana Champaign   (United States)

^b Stress Photonics Inc   (United States)

Author keywords

Bond defects; Bonded silicon; Defect detection; Infrared photoelasticity; Nondestructive evaluation; Wafer bonding

Indexed keywords

EID: 28244445565     PISSN: 09144935     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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