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Volumn 515, Issue 17, 2007, Pages 6698-6706
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Interplay between the deposition mode and microstructure in electrochemically deposited Cu thin films
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Author keywords
Chronoamperometry; Copper; Cyclic voltammetry; Electrochemical deposition; Electron back scatter diffraction; X ray diffraction
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Indexed keywords
CHRONOAMPEROMETRY;
COPPER DEPOSITS;
CYCLIC VOLTAMMETRY;
MICROSTRUCTURE;
SCANNING ELECTRON MICROSCOPY;
X RAY DIFFRACTION ANALYSIS;
DEPOSITION MODE;
DIFFUSION CONTROLLED MODE;
DISLOCATION DENSITY;
ELECTRON BACK SCATTER DIFFRACTION;
THIN FILMS;
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EID: 34247634063
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tsf.2007.01.043 Document Type: Article |
Times cited : (21)
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References (37)
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