Novel slurry solution for dishing elimination in copper process beyond 0.1-μm technology

Thin Solid Films

Volumn 498, Issue 1-2, 2006, Pages 50-55

  Chen, K W ^a   Wang, Y L ^b   Liu, C P ^c   Chang, L ^a   Li, F Y ^d  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b NATIONAL UNIVERSITY OF TAINAN   (Taiwan)

^c NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^d NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

CMP; Copper; Copper slurry; Dishing

Indexed keywords

CHEMICAL MECHANICAL POLISHING; ELECTRIC CONDUCTIVITY; OPTIMIZATION; PASSIVATION; POLISHING; REDUCTION; SLURRIES;

COPPER SLURRY; DISHING; RESISTIVITY DEVIATION;

COPPER;

EID: 30944459684     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.07.061     Document Type: Conference Paper

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