On-wafer monolithic encapsulation by surface micromachining with porous polysilicon shell

Journal of Microelectromechanical Systems

Volumn 16, Issue 2, 2007, Pages 462-472

  He, Rihui ^a,b   Kim, Chang Jin ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b QUALCOMM INC   (United States)

Author keywords

Integrated packaging; Porous polysilicon; Thin film encapuslation; Vacuum encapsulation

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ELECTROCHEMICAL ETCHING; ENCAPSULATION; MEMS; POLYSILICON;

INTEGRATED PACKAGING; VACUUM ENCAPSULATION;

SURFACE MICROMACHINING;

EID: 34147178206     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2007.892797     Document Type: Article

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