Modeling and simulation of IC and package power/ground network

IEEE International Symposium on Electromagnetic Compatibility

Volumn 3, Issue , 2006, Pages 696-701

  Park, Hyunjeong ^a   Gam, Dong Gun ^a   Kim, Joungho ^a   Kim, Hyungsoo ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Hynix Semiconductor Inc   (South Korea)

Author keywords

High frequency; IC and package; Modeling; Power ground network; Simulation

Indexed keywords

BROADBAND NETWORKS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; FREQUENCY DOMAIN ANALYSIS; INTEGRATED CIRCUITS;

BROADBAND FREQUENCY REGION; GROUND NETWORK; HIGH FREQUENCY;

ELECTRIC NETWORK ANALYSIS;

EID: 34047193349     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

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