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Volumn 1, Issue , 2005, Pages 727-731

Co-modeling and co-simulation of package and on-chip decoupling capacitor for resonant free power/ground network design

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; EVALUATION; FREQUENCY DOMAIN ANALYSIS; MICROPROCESSOR CHIPS; NETWORKS (CIRCUITS); RESONANCE;

EID: 24644442311     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (9)

References (5)
  • 1
    • 0033343078 scopus 로고    scopus 로고
    • Power distribution system design methodology and capacitor selection for modern CMOS technology
    • Larry D. Smith, Raymond E. Anderson, Douglas W. Forehand, Thomas J. Pelc, and Tanmoy Roy, "Power distribution system design methodology and capacitor selection for modern CMOS technology," IEEE Trans on AP, Vol. 22, No. 3 (1999), pp. 284-291.
    • (1999) IEEE Trans on AP , vol.22 , Issue.3 , pp. 284-291
    • Smith, L.D.1    Anderson, R.E.2    Forehand, D.W.3    Pelc, T.J.4    Roy, T.5
  • 2
    • 0033346520 scopus 로고    scopus 로고
    • An investigation of PCB radiated emissions from simultaneous switching noise
    • Aug. 1999
    • Radu, S. and Hockanson, D., "An investigation of PCB radiated emissions from simultaneous switching noise," IEEE International Symposium on Electromagnetic Compatibility, Aug. 1999, Volume: 2 (1999), pp. 893-898
    • (1999) IEEE International Symposium on Electromagnetic Compatibility , vol.2 , pp. 893-898
    • Radu, S.1    Hockanson, D.2
  • 3
    • 0035422108 scopus 로고    scopus 로고
    • Resonant free power network design usingExtended Adaptive Voltage Positioning (EAVP) Methodology
    • Alex Waizman and Chee-Yee Chung, "Resonant Free Power Network Design UsingExtended Adaptive Voltage Positioning (EAVP) Methodology," " IEEE Trans on AP, Vol. 24, No. 3 (2001), pp. 236-244.
    • (2001) IEEE Trans on AP , vol.24 , Issue.3 , pp. 236-244
    • Waizman, A.1    Chung, C.-Y.2
  • 4
    • 0141940095 scopus 로고    scopus 로고
    • Coupling of through-hole signal via to P/G resonance and excitation of edge radiation in multi-layer PCB
    • Aug. 2003
    • Jun So Pak, Jingook Kim, Jung-Gun Byun, Heejae Lee, and Joungho Kim, "Coupling of Through-Hole Signal Via to P/G Resonance and excitation of edge radiation in Multi-layer PCB," IEEE International Symposium on Electromagnetic Compatibility, Aug. 2003, Volume: 1 (1999), pp. 18-22
    • (1999) IEEE International Symposium on Electromagnetic Compatibility , vol.1 , pp. 18-22
    • Pak, J.S.1    Kim, J.2    Byun, J.-G.3    Lee, H.4    Kim, J.5
  • 5
    • 0038759067 scopus 로고    scopus 로고
    • Optimized design of MOS capacitors in standard CMOS technology and evaluation of their Equivalent Series Resistance for power applications
    • May.
    • Gerard Villur. Eduard Alarcdn, Francesc Guinjoan and Alberto Poveda, "Optimized design of MOS capacitors in standard CMOS technology and evaluation of their Equivalent Series Resistance for power applications," Proc of the 2003 International Symposium on Circuits and Systems, May. 2003, Volume: 3, pp. III-451-III-454
    • (2003) Proc of the 2003 International Symposium on Circuits and Systems , vol.3
    • Villur, G.1    Alarcdn, E.2    Guinjoan, F.3    Poveda, A.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.