Stress behavior of electrodeposited copper films as mechanical supporters for light emitting diodes

Electrochimica Acta

Volumn 52, Issue 16, 2007, Pages 5258-5265

  Kim, Sunjung ^a   Jang, Jun Ho ^a   Lee, Jeong Soo ^a   Duquette, David J ^b  

^a LG Electronics Inc   (South Korea)

^b RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

Copper electrodeposition; Intrinsic stress; Light emitting diodes; Nucleation and growth

Indexed keywords

COPPER; ELECTRODEPOSITION; FILM GROWTH; GALLIUM NITRIDE; LIGHT EMITTING DIODES; NUCLEATION; STRESS ANALYSIS;

COPPER ELECTRODEPOSITION; COPPER FILMS; COPPER SUPPORTERS; INTRINSIC STRESS;

THICK FILMS;

EID: 34047155568     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2007.02.040     Document Type: Article

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