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Volumn 84, Issue 11, 2004, Pages 1841-1843
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High-power AlGaInP light-emitting diodes with metal substrates fabricated by wafer bonding
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Author keywords
[No Author keywords available]
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Indexed keywords
ANNEALING;
BONDING;
COPPER;
DIFFUSION;
ELECTRIC CURRENTS;
ETCHING;
INDIUM COMPOUNDS;
METALLORGANIC CHEMICAL VAPOR DEPOSITION;
OHMIC CONTACTS;
SEMICONDUCTING ALUMINUM COMPOUNDS;
SEMICONDUCTING GALLIUM ARSENIDE;
SOLUTIONS;
INDIUM-TIN-OXIDES (ITO);
WAFER BONDING;
LIGHT EMITTING DIODES;
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EID: 1842788632
PISSN: 00036951
EISSN: None
Source Type: Journal
DOI: 10.1063/1.1682696 Document Type: Article |
Times cited : (20)
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References (11)
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