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Volumn 152, Issue 3, 2005, Pages

In situ stress measurements during copper electrodeposition on (111)-textured Au

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; COALESCENCE; COMPRESSIVE STRESS; COPPER; ELECTROLYTES; GOLD; GRAIN BOUNDARIES; HONEYCOMB STRUCTURES; MATHEMATICAL MODELS; SCANNING TUNNELING MICROSCOPY; STRESS ANALYSIS; TEXTURES;

EID: 15744386859     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1854093     Document Type: Article
Times cited : (108)

References (64)
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    • Weil, R.1
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    • 0014909447 scopus 로고
    • R. Weil, Plating, 57, 1231 (1970).
    • (1970) Plating , vol.57 , pp. 1231
    • Weil, R.1
  • 8
    • 0014976119 scopus 로고
    • R. Weil, Plating, 58, 50 (1971).
    • (1971) Plating , vol.58 , pp. 50
    • Weil, R.1
  • 43
    • 15744364073 scopus 로고    scopus 로고
    • M. Nakamura and M. Ito, http://www.spring8.or.jp/e/puhlication/res_fro/ RF01B-02A/061-063.pdf
    • Nakamura, M.1    Ito, M.2
  • 62
    • 15744377296 scopus 로고    scopus 로고
    • Ph.D. Thesis, Stanford University
    • V. Ramaswamy, Ph.D. Thesis, Stanford University (2000).
    • (2000)
    • Ramaswamy, V.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.