Effect of triethanolamine on deposition rate of electroless copper plating

Transactions of the Institute of Metal Finishing

Volumn 85, Issue 2, 2007, Pages 103-106

  Jiang, H Y ^a   Liu, Z J ^a   Wang, X W ^a   Wang, Z L ^a  

^a SHAANXI NORMAL UNIVERSITY   (China)

Author keywords

AFM; Deposition rate; Electroless deposition; Superfilling; TEA; XRD

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER; DEPOSITION RATES; ELECTROLESS PLATING; REDUCTION; SURFACE ROUGHNESS; X RAY DIFFRACTION ANALYSIS;

PEAK INTENSITY RATIO; SUPERFILLING; TRIETHANOLAMINE (TEA);

AMINES;

EID: 33947627190     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1179/174591907X177543     Document Type: Article

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