SCOPUS 정보 검색 플랫폼

Materials Research Society Symposium - Proceedings

Volumn 564, Issue , 1999, Pages 399-405

Bath additive and current density effects on copper electroplating fill of Cu damascene structures

(4) Mikkola, Robert D a,b Jiang, Qing Tang a,c Carpio, Ronald a Carpenter, Brad d

a SEMATECH (United States)

b MOTOROLA INC (United States)

c NATIONAL SEMICONDUCTOR CORPORATION (United States)

d Semitool Incorporated (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; ASPECT RATIO; COMPOSITION EFFECTS; COPPER; CURRENT DENSITY; DEPOSITION; ELECTROMIGRATION; ELECTROPLATING; METALLOGRAPHIC MICROSTRUCTURE;

DAMASCENE COPPER; SEAM VOIDS;

ELECTRIC CONTACTS;

EID: 0033279219 PISSN: 02729172 EISSN: None Source Type: Conference Proceeding
DOI: 10.1557/proc-564-399 Document Type: Article

Times cited : (8)

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