Characterization of electroless-plated Cu film over Pd catalytic layer formed by an ionized cluster beam

Journal of the Electrochemical Society

Volumn 152, Issue 10, 2005, Pages

  Wang, Zenglin ^a   Shingubara, Shoso ^b,c   Sakaue, Hiroyuki ^b   Takahagi, Takayuki ^b  

^a SHAANXI NORMAL UNIVERSITY   (China)

^b HIROSHIMA UNIVERSITY   (Japan)

^c ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

CATALYSIS; COPPER; ELECTRIC CONDUCTIVITY; ELECTROLESS PLATING; ELECTROPLATING; IONIZATION; SECONDARY ION MASS SPECTROMETRY; TANTALUM COMPOUNDS;

ADHESION STRENGTH; CATALYTIC LAYERS; COPPER FILMS; IONIZED CLUSTER BEAMS;

THIN FILMS;

EID: 27644555151     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2008990     Document Type: Article

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