Analysis and measures against heat-expansion for sub-micron LD assembly by passive alignment

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 242-246

  Yamauchi, A ^a   Arai, Y ^a  

^a Toray Engineering Co   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; BONDING; FLIP CHIP DEVICES; FRICTION; HEATING; INTERFACES (MATERIALS); OPTICAL DEVICES; SEMICONDUCTING SILICON; THERMAL EXPANSION;

AUTOMATED ASSEMBLY OPERATIONS; PASSIVE ALIGNMENT; TEMPERATURE DRIFT;

ELECTRONICS PACKAGING;

EID: 0034829980     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. Submicron flip chip bonding technology for opto-electronic devices