Effect of Cu-containing solders on the critical IMC thickness for the shear strength of BGA solder joints

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 406-411

  Shin, Chang Keun ^a   Huh, Joo Youl ^a  

^a Korea University   (South Korea)

Author keywords

Aging; Bonding; Copper; Electronics packaging; Intermetallic; Mechanical factors; Morphology; Soldering; Temperature; Testing

Indexed keywords

AGING OF MATERIALS; BONDING; COPPER; ELECTRONICS PACKAGING; FRACTURE; INTERFACES (MATERIALS); INTERMETALLICS; MORPHOLOGY; SHEAR FLOW; SOLDERED JOINTS; SOLDERING; TEMPERATURE; TESTING; TIN;

BALL-SHEAR TEST; BGA SOLDER JOINTS; CRITICAL THICKNESS; CU-CONTAINING SOLDERS; INTERFACE ROUGHNESS; LAYER THICKNESS; MECHANICAL FACTORS; SOLDERING REACTIONS;

SOLDERING ALLOYS;

EID: 23244452897     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906408     Document Type: Conference Paper

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