Application of flip-chip-bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules

Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS

Volumn 2, Issue , 2001, Pages 437-438

  Elger, G ^a   Voigt, J ^a   Oppermann, H ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; BOUNDARY CONDITIONS; DIFFUSION; EUTECTICS; GOLD COMPOUNDS; INTERMETALLICS; METALLIZING; OPTOELECTRONIC DEVICES; SOLDERING ALLOYS;

FLIP-CHIP BONDERS; OPTOELECTRONIC MODULES;

FLIP CHIP DEVICES;

EID: 0035656557     PISSN: 10928081     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Flip Chip assembly using the gold, gold-tin and nickel-gold metallurgy
2. Fluxless die bonding of high power laser bars using the AuSn-metallurgy