Lead-free assembly defects in plastic ball grid array packages

Polytronic 2005: 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Proceedings

Volumn 2005, Issue , 2005, Pages 219-223

  Ganesan, Sanka ^a   Kim, Geunwoo ^a   Wu, Ji ^a   Pecht, Michael ^a   Felba, Jan ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

Interfacial delamination; Moisture sensitivity level; Pb free assembly; Pb free reflow; Popcorning; Printed circuit board; Solder joint defects; Warpage

Indexed keywords

ELECTRONICS PACKAGING; FAILURE (MECHANICAL); FLOW MEASUREMENT; LEAD; POLYIMIDES; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS;

FREE ASSEMBLY; FREE REFLOW; INTERFACIAL DELAMINATION; LEAD-FREE PLASTIC BALL GRID ARRAY (PBGA) PACKAGES; MOISTURE SENSITIVITY LEVELS; SOLDER JOINT DEFECTS;

DEFECTS;

EID: 33847209211     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/POLYTR.2005.1596523     Document Type: Conference Paper

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