Challenges in converting to lead-free electronics

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 6-9

  Garner, C M ^a   Gupta, V ^a   Bissessur, V ^a   Kumar, A ^a   Aspandiar, R ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Assembly; Copper alloys; Electronic packaging thermal management; Electronics industry; Electronics packaging; Environmentally friendly manufacturing techniques; Industrial electronics; Integrated circuit interconnections; Lead; Temperature

Indexed keywords

ASSEMBLY; COPPER ALLOYS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INDUSTRIAL ELECTRONICS; INTEGRATED CIRCUIT INTERCONNECTS; LEAD; SOLDERING; SOLDERING ALLOYS; TEMPERATURE;

CRITICAL FACTORS; ELECTRONIC PACKAGING THERMAL MANAGEMENTS; INTEGRATED CIRCUIT INTERCONNECTIONS; LEAD FREE ELECTRONICS; LEAD-FREE MATERIAL; MANUFACTURING TECHNIQUES; NUMBER OF COMPONENTS; SOLDER TEMPERATURE;

LEAD-FREE SOLDERS;

EID: 24644463750     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906340     Document Type: Conference Paper

References (3)

1. N. C. Lee, "Lead-Free Soldering - Where the World is Going," Advancing Microelectronics, September/October, 1999, p. 29.
2. Press Release, National Electronics and Manufacturing Initiative, Inc., Virginia, 1/17/00.
3. IPC/JEDEC J-STD-020, Moisture /Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices.