Tin Whiskering Risk Factors

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 2, 2004, Pages 427-431

  Pinsky, David ^a   Osterman, Michael ^b   Ganesan, Sanka ^b  

^a RAYTHEON COMPANY   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 85008006515     PISSN: 15213331     EISSN: 15579972     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.831955     Document Type: Article

References (26)

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