Popcorning in PBGA Packages during IR Reflow Soldering

Microelectronics International

Volumn 14, Issue 1, 1997, Pages 20-23

  McCluskey, R R ^a   Munamarty, R ^a   Pecht, M ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 12644288315     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565369710800439     Document Type: Article

References (11)

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3. Yip, W. Y and Tsai, C.T., 'Electrical Performance of an Overmolded Pad Array Carrier (OMPAC)', Proceedings International Electronics Packaging Conference, pp. 731-739 (1993).
4. Hawkins, G., Ganesan, G., Lewis, G and Berg, H., 'The PBGA: A Systematic Study of Moisture Resistance', Proceedings International Electronics Packaging Conference, pp. 588-602 (1994).
5. Miles, B. and Freyman, B., 'The Elimination of the Popcorn Phenomenon in Overmolded Plastic Pad Array Carriers (OMPAC)', Proceedings International Electronics Packaging Conference, pp. 605-614 (1992).
6. Ramirez, C. and Fauser, S., 'Fatigue Life Comparison of the Perimeter and Full Plastic Ball Grid Array', Proceedings Surface Mount International Conference and Exhibition, pp. 258-261, August (1994).
7. Hawkins, G., Ganesan, G., Lewis, G. and Berg, H., 'The PBGA: A Systematic Study of Moisture Resistance', The ISHM International Journal of Microcircuits and Electronic Packaging, Vol. 18, No. 2, pp. 122-131, Second Quarter (1995).
8. Lau, J.H., 'Ball Grid Array Technology', McGraw-Hill, Inc. (1995).
9. Gallo, A. and Munamarty, R., 'Popcorning: A Failure Mechanism in Plastic-encapsulated Microcircuits', IEEE Transactions on Reliability, Vol. 44, No. 3, pp. 362-367, September (1995).
10. Yalamanchili, P., Gannamani, R., Munamarty, R., McCluskey, P. and Christou, A., 'Optimum Processing Prevents PQFP Popcorning', Surface Mount Technology, pp. 39-42, May (1995).
11. Gannamani, R. and Munamarty, R., 'Techniques to Qualify PEMs against Popcorning', Electronic Materials Packaging, pp. 24026, November (1995).