Optimized surface treatment of indium tin oxide (ITO) for copper electroless plating

Japanese Journal of Applied Physics, Part 2: Letters

Volumn 41, Issue 11 A, 2002, Pages

  Kim, Jae Jeong ^a   Cha, Seung Hwan ^a  

^a Seoul National University   (South Korea)

Author keywords

Activation; Copper; Electroless; ITO; Palladium; Tin

Indexed keywords

ADHESION; CHEMICAL ACTIVATION; COPPER; CRYSTAL ORIENTATION; ELECTROLESS PLATING; LIQUID CRYSTAL DISPLAYS; OPTIMIZATION; PALLADIUM; PLASMA DISPLAY DEVICES; SURFACE ROUGHNESS; SURFACE TREATMENT;

EXCELLENT SELECTIVITY; INDIUM TIN OXIDE; ROOT MEAN SQUARE; SENSITIZATION;

INDIUM COMPOUNDS;

EID: 0036869339     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.41.l1269     Document Type: Letter

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