Electroless Deposition of Cu Thin Films with CuCl2-HNO3 Based Chemistry: I. Chemical Formulation and Reaction Mechanisms

Journal of the Electrochemical Society

Volumn 148, Issue 5, 2001, Pages

  Tseng, Wei Tsu ^a,b   Lo, Chia Hsien ^a   Lee, Shih Chin ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000654243     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1359200     Document Type: Article

References (13)

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