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Journal of Electronic Materials

Volumn 35, Issue 12, 2006, Pages 2135-2141

Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates

(2) Huang, Chia Wei a Lin, Kwang Lung a

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

Author keywords

Ag Zn compound; Interfacial reaction; Intermetallic compound; Lead free solder; Sn Zn

Indexed keywords

AG-ZN COMPOUND; INTERFACIAL REACTION; LEAD-FREE SOLDER; SN-ZN;

COPPER; NUCLEATION; QUENCHING; SILVER COMPOUNDS; SOLDERING; SOLIDIFICATION; SURFACE ROUGHNESS; TIN ALLOYS; ZINC ALLOYS;

INTERMETALLICS;

EID: 33846416911 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-006-0323-6 Document Type: Conference Paper

Times cited : (13)

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