Life expectancies of Pb-free SAC solder interconnects in electronic hardware

Journal of Materials Science: Materials in Electronics

Volumn 18, Issue 1-3, 2007, Pages 229-236

  Osterman, Michael ^a   Dasgupta, Abhijit ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; SILVER; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING; TIN;

ELECTRONIC HARDWARE; LEAD-FREE SOLDER; LIFE EXPECTANCIES; TIN-SILVER-COPPER SOLDER;

SOLDERING ALLOYS;

EID: 33845696950     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-006-9017-3     Document Type: Review

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