Characterization of lead-free solder by reliability testing

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2000, Pages 270-273

  Tzan, S R ^a   Chu, S L ^b  

^a Metallic Devices for Electronics Lab   (United States)

^b LOVELACE RESPIRATORY RESEARCH INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; LEAD ALLOYS; MECHANICAL TESTING; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERING ALLOYS; TIN ALLOYS;

LEAD CONTAMINATION; TIN LEAD SOLDER ALLOYS; TIN SILVER SOLDER;

ELECTRONICS PACKAGING;

EID: 0034448322     PISSN: None     EISSN: None     Source Type: Journal    
DOI: 10.1109/IEMT.2000.910737     Document Type: Article

References (10)

1. Lead-free project focuses on electronics assemblies
2. Lead-free soldering - An analysis of the current status of lead-free soldering
3. Improved design life & environmentally aware manufacturing of electronic assemblies by lead-free soldering - IDEALS
4. IPCworks 99
5. Lead-free solder project - Final report
6. An assessment of the use of lead in electronic assembly
7. Euro MP's vote on end-of-life vehicles
8. NEDO project for R&D of lead-free solders toward practical solution and standardization