Effect of stress relaxation on board level reliability of Sn based Pb-free solders

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1210-1214

  Yoon, S ^a   Chen, Z ^a   Osterman, M ^a   Han, B ^a   Dasgupta, A ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CYCLIC MEAN TEMPERATURE; DWELL TIMES; PB-FREE SOLDERS;

FATIGUE OF MATERIALS; LEAD ALLOYS; RELIABILITY; STRESS RELAXATION; THERMAL CYCLING; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 24644452202     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. Bartelo, J. et al, "Thermomechanical Fatigue Behavior of Selected Lead-free Solders," Proc IPC/ SMEMA Council APEX 2001 Conf, San Diego, CA, Jan. 14-18, 2001, pp. LF2-2-1 through LF2-2-12.
2. Clech, J-P., "Lead-free and Mixed Assembly Solder Joint Reliability Trends," Proc IPC/ SMEMA Council APEX 2004 Conf, Anaheim, CA, Feb. 23-26, 2004, pp. S28-3-1 through S28-3-14.
3. Zhang, Q., Isothermal Mechanical and Thermo-Mechanical Durability Characterization of Selected Pbfree Solders, Ph. D. Thesis, 2004, Univ. of Maryland.
4. Syed, A., "Reliability and Au embrittlement of lead free solders for BGA applications," Proc. International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, Piscataway, NJ, 2001. pp. 143-147
5. Roubaud, et al, "Thermal fatigue resistance of Pb-free second level interconnect," SMTA International Proceedings of the Technical Program, Edina, MN, 2001. pp. 803-809
6. Meilunas, M., Primavera, A., and Dunford, S., "Reliability and Failure Analysis of Lead-Free Solder Joints," Proc. of the IPC Annual Meeting, New Orleans, LA, Nov. 3-7, 2002, pp. S08-5-1 to S08-5-14.
7. Swan, G., et al, "Development of Lead-Free Peripheral Leaded and PBGA Components to Meet MSL3 at 260°C Peak Reflow Profile", Proc IPC/ SMEMA Council APEX 2001 Conf, San Diego, CA, Jan. 14-18, 2001, pp. LF2-6-1 to LF2-6
8. Yushi, M. et al, "Development of Environmentally Preferred Plastic Ball Grid Array, PBGA, Components," 2nd International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Dec. 11-15, 2001, pp. 946-951
9. Nelson, D., Pallavicini, H., Zhang, Q., Friesen, P., and Dasgupta, A., 2004, "Manufacturing and Reliability of Pbfree and Mixed System Assemblies (SnPb/Pb-Free) in Avionics Environments," Journal of SMT, Vol. 17, Issue 1, pp. 17-24