Casting of Lead-free Solder Bulk Specimens With Various Solidification Rates

ASM Conference Proceedings: Joining of Advanced and Specialty Materials

Volumn , Issue , 2001, Pages 33-38

  Madeni, J ^a   Liu, S ^a   Siewert, T ^b  

^a Department of Metallurgical and Materials Engineering   (United States)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; ELECTRIC DISTORTION; ELECTRONIC EQUIPMENT; ENERGY DISPERSIVE SPECTROSCOPY; HARDENING; MICROSTRUCTURE; PRINTED CIRCUIT BOARDS; QUENCHING; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; SOLIDIFICATION; TENSILE STRENGTH; TENSILE TESTING;

SURFACE MOUNT COMPONENTS (SMC); TERNARY EUTECTIC SYSTEMS;

SOLDERING ALLOYS;

EID: 1442284455     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. W. L. Winterbottom, "Converting to Lead-Free Solders: An Automotive Industry Perspective," JOM, pg. 20-24. July (1993)
2. "Lead-Free Solder Project," CD - report on the project by the National Center for Manufacturing Sciences, June (1998)
3. Li Xiao, Johan Liu, Songhe Lai, Lilei Ye, and Aders Tholen, "Characterization of Mechanical Properties of Bulk Lead-Free Solders, " 2000 International Symposium on advanced Packaging Materials, pg. 145 -151, (2000)
4. S. Chada, A Herrmann, W. Laub, R. Fournelle, D. Shangguan and A. Achari, "Microstructural Investigation of Sn-Ag and Sn-Pb-Ag Solder Joints," Soldering & Surface Mount Technology, No. 26, pg. 9 - 13, 21, July (1997)
5. M. McCormack, G. W. Kammlott, H. S. Chen, and S. Jin, "New Lead-Free, Sn-Ag-Zn-Cu Solder Alloy With Improved Mechanical Properties," Appl. Phys. Lett. Vol. 65, No. 10, pg. 1233 - 1235, 5 September (1994)
6. M. C. Flemings, Solidification Processing, Materials Science and Engineering Series, p. 146-154, McGraw-Hill, (1974)
7. M. E. Loomans and M. E. Fine, "Tin-Silver-Copper Eutectic Temperature and Composition," Metallurgical and Materials Transactions A, Vol. 31A, pg. 1155 - 1162, April (2000)
8. M. R. Lambert, "Rapid Solidification of Lead-Based Solders," Supplement to the Welding Journal, pg. 215-s - 222-s, June (1989)
9. Dongkai Shangguan, Achyuta Achari, and Wells Green, "Application of Lead-Free Eutectic Sn-Ag Solder in No-Clean Thick Film Electronic Modules, " IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B, Vol. 17, No. 4, pg. 603 - 611, November (1994)