Partitioned viscoplastic-constitutive properties of the Pb-free Sn3.9Ag0.6Cu solder

Journal of Electronic Materials

Volumn 33, Issue 11, 2004, Pages 1338-1349

  Zhang, Qian ^a,b   Dasgupta, Abhijit ^a   Haswell, Peter ^c  

^a UNIVERSITY OF MARYLAND   (United States)

^b DELL INC   (United States)

^c HAMILTON SUNDSTRAND   (United States)

Author keywords

Constitutive property; Creep; Pb free solder; Plastic; Viscoplastic

Indexed keywords

COMPUTER SOFTWARE; COPPER ALLOYS; CREEP; ELECTRIC RESISTANCE; FINITE ELEMENT METHOD; LEAD; MATHEMATICAL MODELS; SILVER ALLOYS; TIN ALLOYS; VISCOPLASTICITY;

CONSTITUTIVE PROPERTY; PB-FREE SOLDERS; THERMOMECHANICAL-MICROSCALE (TMM) TEST SYSTEMS;

SOLDERING ALLOYS;

EID: 10044254397     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0163-1     Document Type: Conference Paper

References (18)

1. Environmental Concepts Inc., "A History of Lead," March 12, 1997, May 3, 2001 〈http://www.gate.net/~verstraa/history.htm〉
2. National Center for Manufacturing Sciences, "Final Report on Lead-Free Alternatives Project" (Ann Arbor, MI: NCMS, 1998).
3. Japan Electronic Industry Development Association (JEIDA), "Challenges and Efforts toward Commercialization of Lead-Free Solder-Road Map 2000 for Commercialization of Lead-Free Solder" (Tokyo: JEIDA, 2000).
4. National Electronics Manufacturing Initiative, "NEMI Group Recommends Tin/Silver/Copper Alloy as Industry Standard for Lead-Free Solder Reflow in Board," Press Release, 24 January 2000, 〈http://www.nemi. org/newsroom/ PR/2000/PR012400.html〉
5. K. Nimmo, Proc. IPC Lead-Free Summit (San Jose, CA: SMTA, 1999), pp. 371-377.
6. National Electronics Manufacturing Initiative, "Overview of Reliability Models and Data Needs," Press Release, February 15, 2001, http://www.nemi.org/newsroom/ Presentations/lf_workshop.html
7. P. Haswell and A. Dasgupta, Proc. Int. Mech. Eng. Congr. Expo. (New York: ASME, 1999).
8. Y. Lee and B.T. Han, "Constitutive Relationships of Binary Lead-Free Solders," CALCE Internal Report C02-07 (College Park, MD: CALCE, 2002).
9. R. Darveaux, K. Banerji, A. Mawer, and G. Dody, Ball Grid Array Technology (New York: McGraw-Hill, 1995), ch. 13, pp. 379-442.
10. W. Engelmaier, Test Method Considerations for SMT Solder Joint Reliability. Proc. 4th Annual Int. Electronics Packaging Conf. (IEPS) Baltimore, MD, October 1984, pp. 360-369.
11. D.H. Avery, W.A. Backofen, Transactions of the American Society of Metals, Vol. 58, pp. 551 (1965).
12. S. Wiese, E. Rzepka, and E. Meusel (Paper presented at 3rd Int. Conf. Benefiting Thermal Mechanical Simulation Micro-Electronics, EuroSIME2002, Paris, April 15-17, 2002).
13. L. Xiao, J. Liu, Zhonghe Lai, LiLei Ye, and A. Tholen, "Characterization of Mechanical Properties of Bulk Lead Free Solders," Proc. Int. Symp. on Advanced Packaging Materials, pp. 145-151, Braselton, GA (March 6-8 2000).
14. Q. Zhang, P. Sharma, and A. Dasgupta, Proc. Int. Mech. Eng. Congr. Expo. (New York: ASME, 2003), pp. 209-214.
15. A. Schubert, R. Dudek, H. Walter, E. Jung, A. Gollhardt, B. Michel, Micromater. Nanomater. 1, 12 (2002).
16. D.R. Frear, J.W. Jang, J.K. Lin, and C. Zhang, JOM 53, 28 (2001).
17. P. Haswell (Ph.D. Dissertation, University of Maryland, 2001).
18. S. Wiese, A. Schubert, H. Walter, R. Dudek, and F. Feustel, 51st Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2001), pp. 890-902.