Study of intermetallic growth on PWBs soldered with Sn3.0Ag 0.5Cu

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1338-1346

  Lee, M ^a   Hwang, Y ^a   Pecht, M ^a   Park, J ^b   Kim, Y ^b   Liu, W ^c  

^a UNIVERSITY OF MARYLAND   (United States)

^b Research Institute of Industrial Science and Technology (RIST)   (South Korea)

^c HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; ELASTIC MODULI; ELECTROLESS PLATING; GOLD PLATING; GROWTH (MATERIALS); HARDNESS; INTERFACES (MATERIALS); INTERMETALLICS; MECHANICAL PROPERTIES; NICKEL PLATING; SHEAR STRENGTH; SOLDERING ALLOYS; TIN ALLOYS;

HOT AIR SOLDER LEVELING (HAL); ORGANIC SOLDERABILITY PRESERVATIVES (OSP); SOLID STATE AGING; THERMAL LOADS;

PRINTED CIRCUIT BOARDS;

EID: 10444241084     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

1. H. Blair, T. Pan, J. Nicholson, "Intermetallic Compound Growth on Ni, Au/Ni, and Pd/Ni Substrates with Sn/Pb, Sn/Ag, and Sn solders", Proc Electronic Components and Technology Conf, 1998, pp. 259-267.
2. I. Chatterji, D. Santos, and F. Andros, "The Effect of Aging on the Shear Strength of Leadfree and Lead Bearing BGA Solder Spheres", Proc NEPCON West - Fiberoptic Expo, 2002, pp. 277-287.
3. R. Fields and S. Low, "Physical and Mechanical Properties of Intermetallic Compounds Commonly Found in solder Joints", Research Publication of Material Performance Group, NIST, Feb. 2002.
4. T. Uno and K. Tatsumi, "Corrosion of Intermetallic Layer and Reliability of Au/Al Bonds", J. Japan Inst. Metals, Vol. 63, No.3, 1999, pp. 406-415.
5. Edwin Bradley, Pradeep Lall, and Kingshuk Banerji, "Effect of Thermal Aging on the Microstructure and Reliability of Ball Grid Array (BGA) Solder Joints", Proc of SMTA, Sept. 1996, pp. 95-106.
6. R. Kisiel and J. Kalenik, "Leadfree Solder Joint Properties in High Temperature Applications", Proc IMAPS, Poland Conference 2000.
7. th Electronic Components and Technology Conf, 1998, pp. 952-961.
8. th Electronic Components and Technology Conf, 2002.
9. th Electronic Components and Technology Conf, 2001, pp. 478-485.
10. th Electronic Components and Technology Conf, 2001, pp.890-902.
11. C. Ho, R. Zheng, G. Luo, A. Lin, and C. Kao, J., "Formation and Resettlement of (AuxNil-x) Sn4 in Solder Joints of Ball-Grid-Array Packages with Au/Ni Surface Finish", Electronic. Mater., Vol. 29, No. 10(2000), pp.1175-1181.
12. G. Milad and J. Martin, "Electroless Nickel/Immersion Gold, Solderability and Solder Joint Reliability as Functions of Process Control", The Article in Magazine Circuitree, October, 2000.
13. E. Brandes and B. Brook, Smithells Metals Reference Book. Sixth Edition, 1992, pp. 11-398.
14. Ronald A. Bulwith, "Soldering to Gold- A Practical Guide", www.alphametals.com/products/solder_solutions/ pdf/soldergld.pdf
15. R.R. Chromik, R.P. Vinci, S.L. Allen, and M.R. Notis, "Nanoindentation measurements on Cu-Sn and Ag-Sn intermetallics formed in Pb-free solder joints", J. Mater. Res., Vol. 18, No. 9, Sep 2003, pp. 2251-2261.