Investigation of Cu/low-k film delamination in flip chip packages

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 709-717

  Zhai, Charlie J ^a   Ozkan, Umit ^a   Dubey, Ajit ^a   Sidharth, ^a   Blish II, Richard C ^a   Master, Raj N ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP PACKAGE INTERACTION (CPI); GLOBAL ANALYSIS; PACKAGE UNDERFILL MATERIALS; PACKAGE UNDERFILL MODULUS;

COPPER; DELAMINATION; DIELECTRIC PROPERTIES; FLIP CHIP DEVICES; MATHEMATICAL MODELS;

THIN FILMS;

EID: 33845571757     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645735     Document Type: Conference Paper

References (15)

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