Finite element analysis of interface cracking in semiconductor packages

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 4, 1999, Pages 503-511

  Nied, Herman F ^a  

^a Lehigh University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CRACK INITIATION; DELAMINATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; FRACTURE; INTERFACES (MATERIALS); SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR DEVICE TESTING; STRAIN; STRESS INTENSITY FACTORS; THERMAL CYCLING;

INTERFACE CRACKING;

ELECTRONICS PACKAGING;

EID: 0033335375     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.814965     Document Type: Article

References (11)

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