Impact of underfill fillet geometry on interfacial delamination in organic flip chip packages

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1604-1610

  Kacker, Karan ^a,b   Sidharth, ^a   Dubey, Ajit ^a,c   Zhai, Charlie J ^a   Blish II, Richard C ^a  

^a ADVANCED MICRO DEVICES   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c NetLogic Microsystems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACIAL STRESSES; ORGANIC FLIP CHIP PACKAGES; UNDERFILL DELAMINATION; UNDERFILL FILLET GEOMETRY;

COMPUTATIONAL METHODS; DELAMINATION; FINITE ELEMENT METHOD; NUMERICAL METHODS; PEELING; STRESS ANALYSIS; SUBSTRATES;

FLIP CHIP DEVICES;

EID: 33845592223     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645871     Document Type: Conference Paper

References (11)

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