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Volumn 1, Issue , 2004, Pages 712-717

Test vehicle to characterize silicon to organic flip chip package thermomechanical interactions

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY TEST CHIP (ATC); BUMP BRIDGING; FLIP CHIP PACKAGES; THERMOMECHANICAL INTERACTIONS;

EID: 10444245790     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (9)

References (16)
  • 5
    • 0037675719 scopus 로고    scopus 로고
    • Pb-free solder challenges in electronic packaging and assembly
    • 2003, 53rd, May 27-30
    • F. Hua, "Pb-free solder challenges in electronic packaging and assembly", Proceedings of Electronic Components and Technology Conference, 2003, 53rd, May 27-30, 2003, pp.58-63.
    • (2003) Proceedings of Electronic Components and Technology Conference , pp. 58-63
    • Hua, F.1
  • 6
    • 0035797072 scopus 로고    scopus 로고
    • Tin - Lead (SnPb) solder reaction in flip chip technology
    • K. N. Tu, K. Zeng, "Tin - lead (SnPb) solder reaction in flip chip technology", Materials Science and Engineering, R 34, 2001, pp. 1-58.
    • (2001) Materials Science and Engineering , vol.R 34 , pp. 1-58
    • Tu, K.N.1    Zeng, K.2
  • 9
    • 0033326202 scopus 로고    scopus 로고
    • Die cracking and reliable die design for flip-chip assemblies
    • November
    • Stylianos Michaelides and Suresh K. Sitaraman, "Die Cracking and Reliable Die Design for Flip-Chip Assemblies", IEEE Transaction on Advanced Packaging, Vol. 22, No. 4, November 1999, pp.602-613.
    • (1999) IEEE Transaction on Advanced Packaging , vol.22 , Issue.4 , pp. 602-613
    • Michaelides, S.1    Sitaraman, S.K.2
  • 10
    • 3042848834 scopus 로고    scopus 로고
    • Investigation of interfaces with analytical tools
    • Accepted for future publication
    • R. Dias, "Investigation of Interfaces with Analytical Tools", Transactions on Device and Materials Reliability, Accepted for future publication, 2003
    • (2003) Transactions on Device and Materials Reliability
    • Dias, R.1
  • 11
    • 84862482264 scopus 로고    scopus 로고
    • "Integrated circuit failure analysis by low energy charge-induced voltage alteration", US patent 5523694
    • Edward I. Cole, "Integrated circuit failure analysis by low energy charge-induced voltage alteration", US patent 5523694.
    • Cole, E.I.1
  • 12
    • 84862478151 scopus 로고    scopus 로고
    • "Light induced voltage alteration for integrated circuit analysis", US patent 5430305
    • Edward I. Cole, Jerry M. Soden, "Light induced voltage alteration for integrated circuit analysis", US patent 5430305.
    • Cole, E.I.1    Soden, J.M.2
  • 14
    • 0030714913 scopus 로고    scopus 로고
    • Stress from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method
    • James N. Sweet, David W. Peterson, John A Emerson, "Stress from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method", Proceedings of 1997 Electronic Components and Technology Conference, pp. 134-143.
    • Proceedings of 1997 Electronic Components and Technology Conference , pp. 134-143
    • Sweet, J.N.1    Peterson, D.W.2    Emerson, J.A.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.