Failure mechanisms of interconnections in drop impact

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1484-1492

  Seah, S K W ^a   Wong, E H ^a   Mai, Y W ^b   Rajoo, R ^a   Lim, C T ^c  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b UNIVERSITY OF SYDNEY   (Australia)

^c NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DROP IMPACT; FAILURE CRITERIA; INTERMETALLIC FAILURE; RESISTANCE MEASUREMENT;

CRACK PROPAGATION; ELECTRIC RESISTANCE; ELECTRONIC CIRCUIT TRACKING; FATIGUE OF MATERIALS; FRACTOGRAPHY; SOLDERED JOINTS;

INTERCONNECTION NETWORKS;

EID: 33845563099     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645852     Document Type: Conference Paper

References (17)

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