Cure shrinkage measurement of nonconductive adhesives by means of a thermomechanical analyzer

Journal of Electronic Materials

Volumn 34, Issue 8, 2005, Pages 1177-1182

  Yu, H ^a   Mhaisalkar, S G ^a   Wong, E H ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Cure shrinkage; Cure stress; Flip chip; Gelation; Nonconductive adhesives (NCAs); Vitrification

Indexed keywords

CROSSLINKING; GELATION; INTEGRATED CIRCUITS; ISOTHERMS; THERMOMECHANICAL TREATMENT; VISCOSITY; VITRIFICATION;

CURE SHRINKAGE; CURE STRESS; FLIP CHIP; NONCONDUCTIVE ADHESIVES (NCAS);

ADHESIVES;

EID: 24144471881     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0248-5     Document Type: Article

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