Internal stresses evolution of non conductive pastes (NCPs) and underfill materials for flip chip applications

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1486-1490

  Jang, Kyung Woon ^a   Kim, Hyoung Joon ^a   Kwon, Woon Seong ^a   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE MATERIALS; CURING; ELASTIC MODULI; GLASS TRANSITION; PARAMETER ESTIMATION; RESIDUAL STRESSES; STRESSES; THERMAL CYCLING;

FLIP CHIP APPLICATIONS; INTERNAL STRESS ESTIMATION; NON CONDUCTIVE PASTES (NCP); UNDERFILL MATERIALS;

FLIP CHIP DEVICES;

EID: 24644504236     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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6. K. W. Jang, "Effects of Silica Filler and Diluent on Material Properties and Reliability of Non-Conductive Pastes (NCPs) for Flip-Chip Applications", IEEE Transactions on Components and Packaging Technologies, Vol.27, No. 3 (2004), pp.608-615.
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