Investigation of Ar incident energy and Ar incident angle effects on surface roughness of Cu metallic thin film in ion assisted deposition

Computational Materials Science

Volumn 38, Issue 2, 2006, Pages 386-394

  Su, Ming Horng ^a   Lu, Jian Ming ^b,c  

^a WUFENG INSTITUTE OF TECHNOLOGY   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^c NATIONAL CENTER FOR HIGH PERFORMANCE COMPUTING   (Taiwan)

Author keywords

Ion assisted deposition (IAD); Ion incident angle; Ion incident energy; Molecular dynamics simulation

Indexed keywords

COMPUTATIONAL METHODS; COMPUTER SIMULATION; DEPOSITION; MOLECULAR DYNAMICS; NUMERICAL ANALYSIS; SURFACE ROUGHNESS;

ION ASSISTED DEPOSITION (IAD); ION INCIDENT ANGLE; ION INCIDENT ENERGY;

THIN FILMS;

EID: 33751060766     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.commatsci.2005.09.014     Document Type: Article

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