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Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 22, Issue 6, 2004, Pages 2273-2275

Smoothing of (111) oriented Cu films by post-deposition in situ 20-100 eV Ar ion bombardment

(2) Kools, J C S a Devasahayam, A J a

a VEECO INSTRUMENTS INC (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIONAL DEPOSITION; ELECTRON VOLTS; ION BEAM TREATMENT; POLAR ANGLE MEASUREMENT;

ATOMIC FORCE MICROSCOPY; COMPUTER SIMULATION; COPPER; ELECTRIC CONDUCTIVITY; ELECTRIC POTENTIAL; ETCHING; GRAIN SIZE AND SHAPE; ION BOMBARDMENT; METALLIC FILMS; MOLECULAR BEAM EPITAXY; MOLECULAR DYNAMICS; SPUTTERING; SUBSTRATES; SURFACE ROUGHNESS; THERMAL EFFECTS;

MULTILAYERS;

EID: 10244252752 PISSN: 07342101 EISSN: None Source Type: Journal
DOI: 10.1116/1.1795825 Document Type: Article

Times cited : (5)

References (12)

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