Design an electroplated frame freestanding specimen for microtensile testing of submicron thin TaN and Cu film

Materials Research Society Symposium Proceedings

Volumn 914, Issue , 2006, Pages 191-196

  Lin, Ming Tzer ^a   Tong, Chi Jia ^a   Chiang, Chung Hsun ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROPLATING; SILICON WAFERS; SPUTTERING; TANTALUM COMPOUNDS; TENSILE TESTING;

ELECTROPLATED STRUCTURES; MICROTENSILE TESTING; TANTALUM NITRIDE;

THIN FILMS;

EID: 33749634309     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-0914-f09-16     Document Type: Conference Paper

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