Cyclic deformation behavior and intergranular fatigue cracking of a copper bicrystal with a parallel grain boundary

Materials Science and Engineering: A

Volumn 272, Issue 2, 1999, Pages 410-417

  Zhang, Z F ^a   Wang, Z G ^a   Hu, Y M ^a  

^a INSTITUTE OF GEOLOGY AND GEOPHYSICS   (China)

Author keywords

Copper bicrystal; Cyclic deformation; GB affected zone; GB strengthening; Intergranular fatigue cracking

Indexed keywords

CRACK PROPAGATION; CRYSTAL ORIENTATION; FATIGUE OF MATERIALS; GRAIN BOUNDARIES; PLASTIC DEFORMATION; STRAIN CONTROL; STRENGTHENING (METAL); STRESS ANALYSIS; SURFACE PHENOMENA;

COPPER BICRYSTAL; CYCLIC DEFORMATION; INTERGRANULAR FATIGUE CRACKING;

COPPER;

DEFORMATION; FATIGUE CRACK; GRAIN BOUNDARY; INTERGRANULAR CRACKING;

EID: 0033619654     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(99)00508-0     Document Type: Article

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