Agglomerated large particles under various slurry preparation conditions and their influence on shallow trench isolation chemical mechanical polishing

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 44, Issue 11, 2005, Pages 7770-7776

  Kim, Dae Hyeong ^a   Kang, Hyun Goo ^b   Kim, Sang Kyun ^b   Paik, Ungyu ^b   Park, Jea Gun ^b  

^a KCTech   (South Korea)

^b Hanyang University   (South Korea)

Author keywords

Agglomeration; Ceria; Large particle; Micro scratch; STI CMP

Indexed keywords

ADDITIVES; AGGLOMERATION; CERIUM COMPOUNDS; CHEMICAL VAPOR DEPOSITION; PH EFFECTS; POLISHING; SLURRIES;

CERIA; LARGE PARTICLE; STI CMP;

CHEMICAL MECHANICAL POLISHING;

EID: 31544462990     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.44.7770     Document Type: Article

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