Effects of grain size and abrasive size of polycrystalline nano-particle ceria slurry on shallow trench isolation chemical mechanical polishing

Japanese Journal of Applied Physics, Part 2: Letters

Volumn 43, Issue 3 A, 2004, Pages

  Kang, Hyun Goo ^a   Katoh, Takeo ^a   Kim, Sung Jun ^a   Paik, Ungyu ^a   Park, Hyung Soon ^b   Park, Jea Gun ^a  

^a Hanyang University   (South Korea)

^b Hynix Semiconductor Inc   (South Korea)

Author keywords

Ceria; CMP; Grain size; Nanotopography; Oxide film; Secondary particle size; Shallow trench isolation; Surfactant

Indexed keywords

ABRASION; CALCINATION; CHEMICAL MECHANICAL POLISHING; COLLOIDS; GRAIN SIZE AND SHAPE; NANOSTRUCTURED MATERIALS; ORGANIC ACIDS; PARTICLE SIZE ANALYSIS; POLYCRYSTALLINE MATERIALS; SURFACE ACTIVE AGENTS; THERMAL EFFECTS;

CERIA; CMP; NANOTOPOGRAPHY; OXIDE FILMS; SECONDARY PARTICLE SIZE; SHALLOW TRENCH ISOLATION;

CERIUM;

EID: 2442560543     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.43.l365     Document Type: Article

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