Thermal residual stresses in an adhesively bonded functionally graded tubular single lap joint

International Journal of Adhesion and Adhesives

Volumn 27, Issue 1, 2007, Pages 26-48

  Apalak, M Kemal ^a   Gunes, Recep ^a   Eroglu, Selim ^a  

^a ERCIYES UNIVERSITY   (Turkey)

Author keywords

Finite element stress analysis; Functionally graded material; Joint design

Indexed keywords

ADHESIVES; BONDING; FINITE ELEMENT METHOD; FUNCTIONALLY GRADED MATERIALS; SHEAR STRESS; SOLDERED JOINTS;

FINITE ELEMENT STRESS ANALYSIS; JOINT DESIGN;

RESIDUAL STRESSES;

ADHESIVES; BONDING; STRESSES;

EID: 33748768218     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2005.09.009     Document Type: Article

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