Stress analysis and strength evaluation of single-lap band adhesive joints of dissimilar adherends subjected to external bending moments

Journal of Adhesion Science and Technology

Volumn 14, Issue 1, 2000, Pages 67-92

  Liu, Jiemin ^a   Sawa, Toshiyuki ^a  

^a UNIVERSITY OF YAMANASHI   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BENDING MOMENTS; DISSIMILAR MATERIALS; ELASTIC MODULI; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); STRAIN; STRESS ANALYSIS; ADHESIVES; ELASTICITY; STRESS CONCENTRATION;

DISSIMILAR ADHERENDS; ADHERENDS; BAND LENGTH; CONTACT PROBLEM; JOINT STRENGTH; SINGLE LAP JOINTS; STRESS SINGULARITY; TWODIMENSIONAL THEORY OF ELASTICITY;

ADHESIVE JOINTS;

EID: 0033940232     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856100742113     Document Type: Article

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