Analysis of the thermal stress behaviour of functionally graded hollow circular cylinders

International Journal of Solids and Structures

Volumn 40, Issue 10, 2003, Pages 2355-2380

  Liew, K M ^a,b   Kitipornchai, S ^c   Zhang, X Z ^d   Lim, C W ^c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^d UNIVERSITY OF QUEENSLAND   (Australia)

Author keywords

Elasticity solution; Functionally graded material; Hollow circular cylinder; Thermal stress

Indexed keywords

BENCHMARKING; COMPOSITION; CYLINDERS (SHAPES); FUNCTIONALLY GRADED MATERIALS; HEAT RESISTANCE; THERMOELASTICITY;

HOLLOW CIRCULAR CYLINDERS;

THERMAL STRESS;

CYLINDER; THERMAL ANALYSIS;

CYLINDER; STRESS; THERMAL PHENOMENA;

EID: 0037992632     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0020-7683(03)00061-1     Document Type: Article

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