Effects of applied pressure and temperature during curing operation on the strength of tubular single-lap adhesive joints

Journal of Adhesion Science and Technology

Volumn 18, Issue 1, 2004, Pages 87-107

  Kim, Jin Kook ^a   Lee, Dai Gil ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Adhesive joint; Adhesive thickness; Applied pressure; Cure temperature; Dielectrometry; Epoxy adhesive; Residual thermal stress; Service temperature; Steel adherend; Tubular single lap

Indexed keywords

ADHESION; CURING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; PRESSURE EFFECTS; RESIDUAL STRESSES; STRENGTH OF MATERIALS; THERMAL EFFECTS; THERMAL STRESS; THERMOCOUPLES; THICKNESS MEASUREMENT; ADHESIVES; TENSILE STRESS;

DIELECTOMETRY; STEEL ADHEREND; TUBULAR SINGLE LAP;

ADHESIVE JOINTS;

ADHESIVE THICKNESS; APPLIED PRESSURE; CURE TEMPERATURE; DIELECTROMETRY; EPOXY ADHESIVES; RESIDUAL THERMAL STRESS; SERVICE TEMPERATURE; TUBULAR SINGLE LAP;

EID: 1342265745     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856104322747027     Document Type: Article

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